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Min/Max layer count
1Layer ~ 22 Layer
Board Thickness
1Layer
2Layer
4Layer
0.8 ~ 1.6mm
0.6 ~ 2.4mm
0.4 ~ 3.2mm
Layer to -layer registration Tollence
5 mil
Maximum Operational Dimensions
21" x 24"
Minimum Circuitry Width
3 mil
Minimum Circuitry Distance
3 mil
Min finished hole size
0.2 mm
Drilling Accuracy
0.1 mm
Min space of Soldermask
0.1 mm
Min channel of SMD pitch
10 mil
Board bow / twist tolerance
0.7 %
Copper Thickness Volume
0.5 oz ~ 4 oz
Surface Treatment
HASL, Lead-free HASL, OSP, Gold Plating, Immersion Gold, Gold Finger, Immersion Tn, Immersion Silver
Impedance control Tollance
100[ 10 H ; 50[10 H